Sensors Expo 2018: Sensor Dev Kit Eases IoT Cloud Connectivity | Sensors Magazine
Dialog Semiconductor’s 15 Degrees-of-Freedom (DOF) SmartBond Multi-Sensor Kit supports sensor connectivity in the Internet of Things (IoT). Built on Dialog’s DA14585 SmartBond System-on-Chip (SoC), the kit allows engineers to easily connect sensors to the cloud at the lowest power and smallest footprint.
Supporting more sensors than any other on the market, the kit allows developers to collect environmental data including temperature, pressure, humidity, gas concentrations, as well as motion, light, sound and magnetic field. This broad capability is especially suited to projects that require rapid prototyping and accelerated time-to-market. Operation and functionality can be easily tailored within its software to match the application, allowing it to be used as a beacon, tag, wireless sensor or mesh node. Additionally, software upgrades are accomplished remotely by utilizing the kit’s SUOTA (Software Upgrade Over the Air) functionality.