Seattle IoT startup Resin.io gets $5 million in new funding from Soracom, a division of KDDI – GeekWire
There’s a land grab underway as the industrial internet of things continues to shift from thought experiment to technology deployment, and a Seattle startup working on a container-based method for deploying IoT apps just got a little more runway to build out that product.
Resin.io has now raised $17 million in funding over the last few years, according to a company representative, with the addition of a new $5 million round from Soracom, a division of massive Japanese wireless carrier KDDI Corp. Soracom, which makes wireless technology designed to connect devices within industrial internet of things setups, is also partnering with Resin.io on forthcoming products that will work more closely together.
Computing power and internet connectivity are making their way into more and more places in modern factories and other industrial settings, as manufacturers and building operators start to realize they can extract interesting data that could make their workflows more efficient. However, it’s a little more challenging to manage these types of devices than it is a stable of PCs or servers, given the constraints under which they operate, and big cloud providers are spending a lot of time and effort positioning themselves for this shift.