PACK EXPO Presentations Geared to Help Improve Manufacturing Operations
Milwaukee; Aug. 30, 2018 (PMMI release) — Professionals who attend this year’s PACK EXPO International in Chicago, Oct. 14–17, can learn about the latest smart manufacturing techniques aimed at delivering value across the enterprise. This year, Rockwell Automation will conduct a series of presentations and demonstrations for end users, machine and equipment builders in packaging and related industries to share the most recent innovations in independent cart technology, analytics and network security.
Rockwell Automation subject matter specialists will present at the PACK EXPO International and Healthcare Packaging EXPO Innovation Stages, featuring the following topics: