Moortec Supporting Today’s Connectivity Boom with IoT Specific Embedded In-Chip Monitoring Subsystem Solution
To support the rapidly evolving IoT landscape, today’s System-on-Chip (SoC) designs require solutions adapted to specific market constraints, which includes power efficiency and device reliability. Moortec’s new monitoring subsystem is developed specifically to physically monitor dynamic and static conditions deep within IoT enabled edge devices, hence enabling tight control over thermal, voltage supply and operational speed conditions. The product is therefore aimed at enabling chip developers to optimise power performance for their low-power end-use applications.
So far, chip monitoring solutions from Moortec have targeted applications areas such as Datacentre & Enterprise, Automotive, AI, Mobile, Consumer and Telecommunications, which utilise advanced node CMOS technologies. With this announcement the company has now made available a highly targeted Process, Voltage and Temperature (PVT) monitoring subsystem variant helping to alleviate the challenges faced by the IoT design community.
Moortec’s IP solution, being the first in its range of IoT targeted products, has been developed for TSMC’s 40nm ULP CMOS technology. By detecting process variability for each chip manufactured and monitoring the dynamic changes to temperature and voltage supply conditions, the IP can be used to enable continuous Dynamic Frequency and Voltage Scaling (DVFS) and Adaptive Voltage Scaling (AVS) optimisation schemes. The subsystem delivery also includes a sophisticated PVT Controller with AMBA APB interfacing, supporting multiple monitor instances, statistics gathering, production test access support as well as other compelling features.